產品介紹 PRODUCTS
FVO-450 High Temperature Vacuum Oven
Table of Contents
• FVO-450-x High Temperature Application
• FVO-450-x High Temperature Key features
• Software Control System
• Oven Chamber Description
• EFEM Spec
• Single Chamber Baking Oven Layout
• Dual Chamber Baking Oven Layout
• Global Service
• FVO-450-x High Temperature Application
• FVO-450-x High Temperature Key features
• Software Control System
• Oven Chamber Description
• EFEM Spec
• Single Chamber Baking Oven Layout
• Dual Chamber Baking Oven Layout
• Global Service
Major Applications
- 3DIC profile cure
- Anneal
- PI Cure
- PCB Cure
- Photoresist Cure
- Copper Anneal
- Copper Oxide Removed
- Thermal Cure
- Moisture Removed
- Photoresist Removed
- Re-flow
High Temperature Vacuum Oven Key Features-1
- Fully Automatically Operation with 2 or 4 FOUP opener
- Friendly GUI operating interface
- Multi recipes and CIM control
- Data collection to record process variables such as temperature, pressure, gas flow,..for real time control
- Reliable dual arm robot for wafer transfer
- Transfer environmental cleanness: better than class 10
- Oven Chamber cleanness: class10
- Capacity of 50 wafers per chamber , two chambers:100 wafer
- Scroll Pump assembly, dry, lubricant-free, vacuum pump
High Temperature Vacuum Oven Key Features-2
- Preheated N₂ Process Gas
- O2 concentration < 10 ppm
- TC in chamber to monitor temperature in real time
- Air-cooled chamber with external forced air convection
- Dual Condensate Filter Assembly
- ID-System: Standard RFID reader (134.2KHz) Optional IR-Link or Barcode
- E-84 Function for OHT system (Optional)
- SECS/GEM Communication with Host (Optional)
- UPS: 30 min power maintain for IPC