Model:FO-3200-XYZ

• To upgrade 846, 866 and 124 DOS-based older generation Hosts
• Graphical Management Interface
• Recipe editing and management
• Data collection and analysis
• Status information

To replace obsolete controllers：
• Diffusion Furnaces (Bruce, TEL, Thermco, Tystar, Tempress, etc.)
• Gasonics Hypox Systems
• ASM and Pacific Western Plasma CVD Systems

The SuperTMX will add years of reliable service life to your aging Thermco MUX Controllers.
SuperTMX 將為您老化的 Thermco MUX 控制器增加多年的可靠使用壽命。

• CAN Open control circuit - minimum wiring, easily maintenance and expandable circuit.
• RS232/TCPIP communication protocol
• Web GUI control/configuration
• Flexible macros/motions design.
• Class 1 cleanness
• SCARA/Linear various types available
• Customer design track length
• Various end-effecter design to suit different applications
• Customized design available

• CAN Open control circuit - minimum wiring, easily maintenance and expandable circuit.
• RS232/TCPIP communication protocol
• Web GUI control/configuration
• Flexible macros/motions design.
• Class 1 cleanness
• SCARA/Linear various types available
• Customer design track length
• Various end-effecter design to suit different applications
• Customized design available

• CAN Open control circuit - minimum wiring, easily maintenance and expandable circuit.
• RS232/TCPIP communication protocol
• Web GUI control/configuration
• Flexible macros/motions design.
• Class 1 cleanness
• SCARA/Linear various types available
• Customer design track length
• Various end-effecter design to suit different applications
• Customized design available

• CAN Open control circuit - minimum wiring, easily maintenance and expandable circuit.
• RS232/TCPIP communication protocol
• Web GUI control/configuration
• Flexible macros/motions design.
• Class 1 cleanness
• SCARA/Linear various types available
• Customer design track length
• Various end-effecter design to suit different applications
• Customized design available

• CAN Open control circuit - minimum wiring, easily maintenance and expandable circuit.
• RS232/TCPIP communication protocol
• Web GUI control/configuration
• Flexible macros/motions design.
• Class 1 cleanness
• SCARA/Linear various types available
• Customer design track length
• Various end-effecter design to suit different applications
• Customized design available

Model:FO-3100-XYZ

Model:FO-3100-XYZ

The fully automatic Fortrend LPT+ S transfers 200mm cassettes from SMIF pods onto process stages in 90 seconds or less. The system can also be used to load cassettes into process tools in a non-SMIF environment.

With a total footprint not much larger than a SMIF pod, the LPT+ S-X is easy to integrate with AGV system and into small areas.

A programmable robotic arm with end-effector that tilts wafers into the vertical position accommodates a wide variety of process tools.

The fully automatic Fortrend LPT+ Sx transfers 200mm cassettes from SMIF pods onto process stages in 90 seconds or less. The system can also be used to load cassettes into process tools in a non-SMIF environment.

With a total footprint not much larger than a SMIF pod, the LPT+ Sx is easy to integrate with AGV system and into small areas.

A programmable robotic arm and end effector that can tilts 90˚ and does extra 85mm lateral movement supporta wide variety of process tools that cannot be used with standard models.

The fully automatic Fortrend LPT+ Cx model transfers 200mm cassettes from SMIF pods onto process stages in 90 seconds or less. The system can also be used to load cassettes into process tools in a non-SMIF environment.

With a total footprint not much larger than a SMIF pod, the LPT+ Cx-X is easy to integrate with AGV system and into small areas.

A programmable robotic arm and end effector that can tilts 90˚ and do extra 85mm lateral movements supporta wide variety of process tools that cannot be used with standard models.

With 1507mm height, LPT+ Cx-X can connect to process tool without blocking operation panel or monitor screen right above the load lock.

The fully automatic Fortrend LPT+ R-X transfers 200mm cassettes from SMIF pods onto process stages in 90 seconds or less. The system can also be used to load cassettes into process tools in a non-SMIF environment.

With a total footprint not much larger than a SMIF pod, the LPT+ R-X is easy to integrate with AGV system and into small areas.

A programmable robotic arm and end effector that rotates 350˚ offers angled cassette placement and small chamber space that cannot be accessed by any other existing SMIF solutions. PLPT+ R model illustrates another engineering excellence of Fortrend products.

Features：
• Small footprint saves valuable FAB floor space
• Class 1 cleanliness with active self-clean air flow design.
• Lifts the Pod shell leaving the Wafer Cassette in a sealed mini-environment
• All electrical system with field programmable application software
• Four programmable Interlock signals
• Wafer Cassette Present Sensor
• Pod Present Sensor
• Wafer/Reticle Mapping Sensor (Present, Cross Slot)
• Meets SEMI E19.4, S2 and S8 standards and CE certified
• Mounts directly into a process Tool or to a manual load port adaptor (300mm Bolts interface to SEMI E63) to convert open station to a SMIF compatible station.
• Optional RFID reader/writer
• Optional IR reader/writer

Feattures
• Ullttra smallll ffoottpriintt saves valluablle ffab fflloor space
• LED Sttattue IIndiicattor

• 300 mm/200mm wafers transfers
• Class 1 environment with integrated ionizers
• Compact footprint with field proven chassis design
• Simple graphic user interface with touch screen
• SECS/GEM capabilities
• Reliable performance using Fortrend field proven load port and robot
• Wafer alignment and notch finding
• Support 200mm cassette adaptor on 300mm load ports
• Wafer ID (OCR) reading
• RFID/Smart Tag/Barcode reading
• Ultra-Thin Wafer (Optional)
• No Touch End Effectors(Optional)

Table of Contents
• FVO-450-x High Temperature Application
• FVO-450-x High Temperature Key features
• Software Control System
• Oven Chamber Description
• EFEM Spec
• Single Chamber Baking Oven Layout
• Dual Chamber Baking Oven Layout
• Global Service

• The Oven system has integrated mini-environment, 300mm load ports, wafer robot, cassette robot, and oven and control unit.
• Field proven application: 3DIC baking, photo-resist baking, moist removal, reflow and thermal process.
• 200mm cassette manual/auto load available.
• Wide operating range: ambient ~ 250 degrees.
• Full automatic.
• Friendly operational interface.
• Class 10 for Baking Chamber
• Better Class 10 for Oven System
• Process Gas Input: N2, up to 3 gases
• Nitrogen Consumption: 10L/min
• Temperature Uniformity: ± 3.5oC
• Number of Recipe: Programmable
• Wafer bumping interlock
• Wafer and robotic arm protrusion detection
• Main controller: IPC
• OS: Windows XP professional
• Modular design minimizes adjustments, maintenance and downtime
• S2,S8 compliant