• The Oven system has integrated mini-environment, 300mm load ports, wafer robot, cassette robot, and oven and control unit.
• Field proven application: 3DIC baking, photo-resist baking, moist removal, reflow and thermal process.
• 200mm cassette manual/auto load available.
• Wide operating range: ambient ~ 250 degrees.
• Full automatic.
• Friendly operational interface.
• Class 10 for Baking Chamber
• Better Class 10 for Oven System
• Process Gas Input: N2, up to 3 gases
• Nitrogen Consumption: 10L/min
• Temperature Uniformity: ± 3.5oC
• Number of Recipe: Programmable
• Wafer bumping interlock
• Wafer and robotic arm protrusion detection
• Main controller: IPC
• OS: Windows XP professional
• Modular design minimizes adjustments, maintenance and downtime
• S2,S8 compliant